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Today, at work.10.6 QUALITY AND RELIABILITYII475Mold compoundPassivation layer cracksChipAdhesiveLeadframeFiller particles Stress relieve agents 0# O a 4*0e%Q*o.Deformation of metallizationBall bond fractureChip cracksLeadVoids Delamination Package cracksFigure 10-37. Typical Failure Mechanisms,
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Today, at work. 10.6 QUALITY AND RELIABILITY II—475 Mold compound Passivation layer cracks Chip Adhesive Leadframe Filler particles Stress relieve agents 0# O a 4 °*0e °%Q»*o. Deformation of metallization Ball bond fracture Chip cracks Lead Voids Delamination Package cracks Figure 10-37. Typical Failure Mechanisms, Sites, and Modes in Plastic-Encap-sulated Devices (From Ref. I.) to wirebonding, encapsulation, postmold exothermic curing, rework on neighboring components, dipping in molten solder, vapor-phase soldering, and reflow soldering. External thermal loads lead to changes in dimensions because of thermal expansion and can change such physical properties as Ball bond fracture Casino
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