james bond

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So i've posted this in comments here: http://joyreactor.com/post/1051754, but what the hell, i want to everyone see how cool I am!

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$Today, at work. 10.6 QUALITY AND RELIABILITY II—475 Mold compound Passivation layer cracks Chip Adhesive Leadframe Filler particles Stress relieve agents 0# O a 4 °*0e °%Q»*o. Deformation of metallization Ball bond fracture Chip cracks Lead Voids Delamination Package cracks Figure$